Our main brands

Bostik Worldwide

Bostik around the world

Designed to meet today's demands for strength, durability and versatility

Increasing mass production and miniaturization of electronic devices calls for faster, stronger and more precise bonding processes to new substrates. At Bostik, we understand the challenge this brings when it comes to addressing:

  • Precise application needs
  • Design requirements
  • Aesthetic demands

By analyzing the limitations of other assembly adhesive bonding technologies, our experts were able to address them with innovative instant engineering adhesives that propel your manufacturing processes and end-use electronics forward, offering:

  • Enhanced worker safety and comfort due to low odor
  • Improved final aesthetics due to low blooming
  • Increased performance capabilities due to being less brittle than conventional instants
  • Heightened application flexibility due to various open and fixture times

FIND OUT WHAT CONSIDERATIONS TO MAKE WHEN NEEDING AN ELECTRONICS ADHESIVE.

Born2Bond® Engineering Adhesives

Today, engineering adhesives are the primary solution for assembling electric vehicles, smartphones, medical and other electronic devices.

Available in a range of advanced formulations, Born2Bond® instant adhesives overcome many of the performance and application limitations of existing solutions. They also facilitate faster, smarter production processes while prioritizing user safety and sustainability.

Born2Bond® Engineering Adhesives for the Modern World

Heat shrinkable tubing (HST)

HST provides quick and easy solutions for cable bundles, electric insulation, sealants, and other types of protection. Used in wide variety of applications, including electronics, automotive, appliance, or underground pipelines, the dual wall addition with inner adhesive layer ensures the best performance of tight sealing and durability.

Our polyamide- and polyolefin-based hot melts allow for easy processability, durable performance, good flowability during reactivation, and instant bond strength.

Low pressure molding (LPM)

LPM technology serves an important role in protecting and sealing electric component items against moisture, dust and dirt.

Bostik's LPM solutions include Thermelt, a comprehensive range of hot melt polyamide adhesives designed to meet customers’ unique needs. Multipurpose with high temperature resistance and oil, these adhesives offer easy processability at low pressure and low temperatures, enabling them to encapsulate sensitive electronics for the most demanding environments.

Bostik also manufactures reactive polyamides that cure after application to form a cross-linked network providing superior temperature resistance up to 200°C.

Discover more about Electronic Adhesives

Assembly Adhesives

Read more
assembly_666x295-crop400x299.jpg
assembly_666x295-crop400x299.jpg

Heat Shrink Tubing

Read more
HeatShrink Tubing_shutterstock_141032014.jpg
HeatShrink Tubing_shutterstock_141032014.jpg

Low Pressure Molding

Read more
Low pressure molding usb.jpg
Low pressure molding usb.jpg

Discover More Assembly Adhesives

Renewable_Energy_Wind_power_iStock_60962526.jpg
Renewable_Energy_Wind_power_iStock_60962526.jpg

Filtration Adhesives

Read More
Filters_shutterstock_574217875.jpg
Filters_shutterstock_574217875.jpg

Furniture Assembly Adhesives

Read More
Furniture_Office_shutterstock_123936604.jpg
Furniture_Office_shutterstock_123936604.jpg

Adhesives for Industrial Manufacturing

Read More
Manufacturing_Assembly Line_shutterstock_518713594.jpg
Manufacturing_Assembly Line_shutterstock_518713594.jpg

Textile & Footwear Adhesives

Read More
Textiles_shutterstock_1187193994.jpg
Textiles_shutterstock_1187193994.jpg